Qualcomm has completed the 909,170-sf Building W Campus in San Diego. The three-building project was designed by Delawie Wilkes Rodrigues Barker and built by general contractor Roel Construction with Burkett & Wong as structural engineer and Walsh Engineers as mechanical engineer.
Santa Clara, Calif.-based Intel Corp. is beginning construction in early spring of 2006 on a $300-million semiconductor assembly and test facility in Ho Chi Minh City, Vietnam. Production at the plant is slated to begin in the second half of 2007. The facility will eventually employ 1,200 workers.
Intel Corp. will construct a new $100-million facility at its R&D campus in Folsom, Calif. Completion is slated for late 2007.
Affymetrix, a maker of DNA array chi, has initiated construction on a new 110,584-sf manufacturing plant in West Sacramento, Calif. Accommodating production lines for the company's next generation of high-resolution GeneChips, the facility will double Affymetrix's output by the second half of 2007. Affymetrix's existing West Sacramento facility is 52,000 sf. Additionally, Affymetrix has purchased a 100,000-sf former semiconductor factory in Singapore which it will convert for production.
UAlbany's College of Nanoscale Science and Engineering is planning to construct the $435-million Institute for Nanoelectronic Discovery and Exploration. The project includes a new 250,000-sf facility with a 100,000-sf cleanroom to be built at the Albany Center for Excellence. The institute is being co-created by the Semiconductor Industry Association and the Semiconductor Research Corp. A second institute will be located in California's Silicon Valley.
Santa Clara, Calif.-based Intel Corp. is initiating construction on a $3.5-billion wafer fabrication plant at its existing campus in Kiryat Gat, Israel. Slated for completion in the second half of 2008, the facility will house 200,000 sf of cleanroom space for manufacturing 300mm wafers. Additionally, Intel will complete the expansion of its plant in Ireland by the first quarter of 2006. Intel is also planning to construct another plant in Chandler, Ariz., that will produce both 300mm and 45nm wafers.
Sunnyvale, Calif.-based Advanced Micro Devices is planning to construct an 825,000-sf campus on 59 acres in Austin, Texas. General contractor Austin Commercial LLP of Dallas will build the project, which is currently awaiting the approval from the City of Austin. The campus has an estimated construction cost of $200-million. Construction is expected to begin in early 2006 with completion slated for mid-2007. Employee occupancy will begin in early 2007.
Intel Corp. is investing $190 million to increase the capacity of its wafer fabrication plant in Colorado Springs, Colo. Construction will begin in fall 2005 to upgrade the facility with a second cleanroom that will allow the final stage of microprocessor processing. Completion is expected in the second half of 2007. Santa Clara, Calif.-based Intel will also invest $155 million in its Hudson, Mass., plant for the same purpose.
Hewlett Packard Co. has expanded its presence in Memphis, Tenn., with the lease of the 789,000-sf Summit Distribution Center II. The facility will accommodate distribution operations for HP's imaging and printing businesses. Operations at the Memphis facility will be filled by Menlo Worldwide, a third-party supplier. The facility is expected to become operational in fall 2005.
Intel Corp. is initiating construction on the $3-billion "Fab 32" facility in Chandler Ariz. Located on Intel's Ocotillo campus, the 300-mm wafer fabrication plant will begin making microprocessors in the second half of 2007 on 45 nanometer process technology. The 1 million-sf facility will house 184,000 sf of clean room space. Additionally, Intel will invest $105 million to convert an inactive existing wafer fab in New Mexico to a temporary component test facility.
The New Mexico Institute of Mining and Technology has opened an electronics testing facility in Socorro, N.M. The MicroElectronics Testing, Technology & Obsolescence Program (METTOP) has now completed and occupied its 6,500-sf laboratory. Funded by $8.5 million in federal appropriations, the laboratory provides space for determining how much radiation the electronics used in military and space applications can withstand. The program also involves testing and consultation for electronic component obsolescence.
Embedded computer component maker SBS Technologies has relocated to its new $7-million office and assembly building in Albuquerque, N.M. Providing 17,000 sf more space than SBS' previous Albuquerque location, the 47,000-sf facility is located in the Journal Center II development.
Thales Avionics has completed the design and construction of a tenant improvement project for its two-story, 127,000-sf Irvine, Calif., facility. Located in the Irvine Spectrum Business Park, the project was designed by Irvine-based Ware Malcomb with Turelk of Long Beach, Calif., as general contractor. The facility includes a manufacturing area; R&D engineering and training space; corporate lobby; general office space; conference rooms; demonstration rooms; secure access; a vibration room; and an exterior LN2 tank.
IBM Corp. and six other semiconductor companies will invest $1.9 billion to construct a chip manufacturing plant in East Fishkill, N.Y. The plant will creat 750 jobs, in addition to 250 research-related positions. The partners in the consortium are reported to include Samsung, Sony Corp., Toshiba, Infineon Technologies, Chartered Semiconductor Manufacturing, and Advanced Micro Devices.
Chip-equipment maker FormFactor opened its new $55-million headquarters and manufacturing facility in Livermore, Calif., in October of 2004. Doubling FormFactor’s previous footprint, the 135,000-sf building will increase probe card production and enable the company’s development of probe cards for different types of chips. Employees will be shifted to the new facility incrementally; an additional building housing a cafeteria and a gym is still in development at the site.
