Reutlingen, Germany
The Bosch Group is building a €550 million fab for 200 millimeter semiconductors in Reutlingen, Germany. The facility began construction in fall of 2007 with production commencing in mid-2009. The plant will be able to produce 1,000 silicon wafers per day and will support Bosch’s automotive electronics business operations, including MEMS and micromachined chip technologies.
