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Binghamton University Breaks Ground on S3IP Technology Center

Published 10/19/2010

Binghamton University broke ground on the $30 million New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) in October of 2010. Housing laboratory space, offices, and a symposium hall, the 114,000-sf facility will connect the Biotechnology and Engineering buildings as part of the Innovative Technologies Complex. The center will promote collaborative research in microelectronics with industry partners. LEED sustainable design certification will be sought for the project.