Beijing, China
Tsinghua University is partnering with semiconductor manufacturer Rohm Co. to build the Tsinghua-Rohm Electronic Engineering Hall in Beijing, China. Designed to support collaborative development of electronic devices, the ¥2 billion R&D facility is slated for completion in April of 2011. The project will house an international exchange center for academic-industry partnerships, cleanrooms, shared research space, and a 300-seat auditorium.