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Tsinghua University Partners with Rohm on Electronic Engineering Hall

Published 9/29/2008

Tsinghua University is partnering with semiconductor manufacturer Rohm Co. to build the Tsinghua-Rohm Electronic Engineering Hall in Beijing, China. Designed to support collaborative development of electronic devices, the ¥2 billion R&D facility is slated for completion in April of 2011. The project will house an international exchange center for academic-industry partnerships, cleanrooms, shared research space, and a 300-seat auditorium.